Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) Stacked Die Package
Advanced Materials Research, 2010
Page 1. Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) ... more Page 1. Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) Stacked Die Package Azman Jalar 1, a , Saidatul Azura Radzi 1, b and Muhammad Azmi Abd Hamid 2, c 1Institute of Microengineering and Nanoelectronic (IMEN) ...
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robust ball bonding. The objective of this investigation is to determine the effect of power
and force on bonding process for 99.99% gold wire for wire type A and B in Quad Flat NoLead (QFN) 3D stacked-die packages. Both wires with diameter of 25.4 μm and bonding
temperature of 200ºC were used. The ultrasonic current or USG current was in the range of
70 mA to 90 mA while bonding load in the range of 15 g to 45 g. The result from scanning electron microscope (SEM) shows the ball bonding formation effect by different variation of power and force. The lower bonding load (15 g) give good ball bonding shape as compared to higher bonding load (45 g) for the same USG current and wire type. Bonding load is considered as critical factor as compared to USG current and wire type.
technique. A series of micro-tensile test were performed with different strain rate values of 10˚-10-4 min-1 on to a 25.4 µm diameter plain gold wire. The nanoindentation with 20 mN maximum load was indented on a near fracture end of a gold wire specimen, for which this test was carried out after the microtensile test. The stress-strain curves were used to characterize the 4N purity gold wire. The shapes of fracture end of gold wire after micro tensile test were carried out using Scanning Electron Microscopic (SEM). The finding showed
that the mechanical properties of ultra-fine gold wire was in the proportional relationship with the increment of the strain rate value. It is suggested that micromechanical behaviour gave the effect for the wirebonding process in order to characterize the wire loop control and strengthen the wire loop to avoid the wire sweep
chip and circuit board. The effect of trace elements on the mechanical properties of 4N gold wire has not been
widely investigated for some years despite the important of wire-bonding and the move towards fine pitch
applications. The objective of this study is to determine the effect of mechanical properties of two type of gold
wire (wire A and wire B) on looping and pull strengths. Both wires with diameter of 25.4μm were bonded
using K&S Maxum by maintaining the temperature at 200ºC. Due to the element analysis, atomic percentage
of Ca in wire B is higher than wire A. Pull strength increase with the increasing of the trace element. The
higher pull strength of wire B could improve the yield strength, elastic modulus and recrytallization
temperature.